The 2018 GaN power electronics roadmap

SCENET roadmap for superconductor digital electronics

The roadmap gives an overview on status and future developments in Superconducting Digital Electronics (SDE). Key areas in SDE under focus are applications, circuit simulation and design, circuit fabrication, interfacing and testing, cooling and system aspects, and new devices and materials. Care was taken to establish the vital link between research and development on the one hand and the indu...

Power Electronics and Wind Power

Renewable energy facilities will constitute a major contribution to electrical power in the future. The wind turbine will, together with biomass, form the major renewables parts up to year 2030 including erection of offshore wind farms. The wind is a non-storable energy source, whose electric energy needs priming into interchangeable energy to be competitive for large-scale power generation. An...

Introduction to Power Electronics Introduction to Power Electronics

Novel packaging solutions for GaN power electronics: Silver-diamond composite packages

We present a new packaging solution for GaN power electronics for efficient heat extraction needed for high power devices. The benefits of using silver diamond composite as base plate in packages for GaN power bars is demonstrated. A dramatic improvement in thermal management (as high as ~50%) was obtained with respect to the existing packaging technologies based on CuW. Micro-Raman thermograph...

Improved thermal management for GaN power electronics: Silver diamond composite packages

A novel packaging solution for GaN power electronics for efficient heat extraction in high power devices is presented. The benefits of using silver diamond composites as base plate in packages for GaN power bars are demonstrated. Micro-Raman thermography measurements were carried out to probe the device temperature for devices mounted on different base plates, silver diamond composites and stan...